Redmi 9 lancelot bootloop gagal update ke MIUI 13 dan tidk bisa masuk fastboot

langkah pertama coba lakukan reset dengan bantuan tool, tapi hasilnya gagal.

Akhirnya saya downgrade ke versi MIUI 12

silahkan download lancelot_id_global_images_V12.0.1.0.QJCIDXM_20201204.0000.00_10.0_global

Error spflashtool

Jika rekan2 waktu flashing mengalami error seperti di bawah

S_SECURITY_SEC_CFG_IMAGE_CUST_NAME_MISMATCH (6074)

S_SECURITY_SF_CODE_FORMAT_FORBIDDEN

coba gunakan sp flashtool versi ini v5.1824.00

Download DISINI

Meizu m6 matot

 Datang meizu M6 matot korban speaker aktif. done dengan cara ganti ic power MT6353v

isp direct xiaomi mi a2 lite

 Download dump file MI A2 Lite DISINI, password: globaltechno45

oppo f3 plus bypass frp via ufi box

 Caranya:

masuk mode driver qualcomm 9008 dengan cara tekan volume atas bawah bersamaan langsung hubungkan hp dengan pc.

setelah connect klik identify device lalu klik clear FRP lock. done

Log ufi box Device lifetime: Urgent (consumed 90% of the reserved block)

 Ada yang pernah mengalami hal seperti ini, seperti muncul error Device lifetime: Urgent (consumed 90% of the reserved block) saat direct emmc. Kali ini saya ambil contoh dari device oppo A7 CPH1901.

Sebelum memfonis kerusakan emmc, kalau emmc pake skhynix coba lakukan repartisi ulang. jika sukses insyaAlloh emmc bisa dipake lagi, tapi gak lama biasanya akan bootloop lagi. seperti oppo a7 yang saya kerjakan. 2 hari sudah balik bootloop lagi. tapi yang oppo a3s bisa bertahan lama.

oppo a7 cph1901

oppo a3s

kesimpulannya: coba partisi ulang ic emmcnya, jika tidak bisa berarti emmc sudah minta ganti. berdassarkan pengalaman di meja service.

log:

Connection status: IUSB3HUB:USB 2.00 High-Speed

Interface: UFI High-Speed

Serial number: 0011-8839-1731

 Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)

Insertion test... Done

Init bus...

VCC: 3.3 V, VCCQ: 1.8 V

Bus: 1 bit (SDR 4MHz)

Access mode: sector mode

Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)

 Card/BGA: BGA (Discrete embedded) - High density MMC

 Manufacturer ID: 0x90 (SK Hynix)

 Product name: HCG8a4 (0x484347386134), rev: 0xA5, serial number: 0x4C60C29F

 Manufacturing date: Okt 2018

CID: 90014A48 43473861 34A54C60 C29FA534

CSD: D0270132 8F5903FF FFFFFFEF 8A400026

EXT_CSD revision: 1.8 (MMC v5.1) 

Partition info:

 Boot1: 4096 KiB

 Boot2: 4096 KiB

 RPMB: 4096 KiB

 User area: 58.24 GiB(62,537,072,640 bytes)

Cache size: 1 MiB

Hardware reset function: 1

Partition configuration: 0x38

 No boot acknowledge is sent (default)

 User area is enabled for boot

Partitioning support: 0x07

 Device support partitioning feature

 Device can have enhanced technological features

 Device partitioning possible

Boot configuration protection: 0x00

Boot bus conditions: 0x00

Boot area write protection: 0x00

 Power-on write protection: possible

 Permanent write protection: possible

 Lock status: not locked

ANDROID System Info:

 platform: msm8953, cpu abi: arm64-v8a

 manufacturer: OPPO

 board: msm8953, name: CPH1901

 brand: OPPO, model: CPH1901 (OPPO A7)

 build model list: CPH1901 (OPPO A7)

 build id: OPM1.171019.026, version: 8.1.0 Oreo (CPH1901EX_11_A.19)

 build description: msm8953_64-user 8.1.0 OPM1.171019.026 eng.root.20200916.001123 release-keys

crypto state: encrypted?

EXT_CSD backup saved to "\\%BACKUPS%\HCG8a4_4C60C29F.ext_csd"

eMMC 5.x HEALTH report:

 Device lifetime: Urgent (Consumed 90% of the reserved block)

 Estimation of the device lifetime (SLC): 0% - 10% device life time used

 Estimation of the device lifetime (MLC): 20% - 30% device life time used

Selected: [HYNIX] H9TQ52ACLTMCUR/64GB   (BGA221)

Repair imei dan baseband redmi 2 ekor 11 maupun 13 tested 100%

Masuk mode diag tanpa root tekan *#*#13491#*#*

1. Buka UFI BOX

2. Langkah pertama write imei dulu

3. Write qcn

4. Restart HP

untuk file qcn silahkan download DISINI tanpa password